Different material types (Metals/semiconductors /dielectric) Thin film deposition on different substrates Targets (Au, Ag, Cu, Ti, Ni, Cu, Al, C, Si, ITO, ZnO, Al-ZnO, etc.
Thermal evaporation of materials using Mo/W boats.
Bulk metallic films of high conductivity and shiny style on Silicon, glass, plastic and other substrates.
Selective High Speed laser system for patterning and dryer lithography processing with 25um accuracy using CAD designs on different materials.
Measure Coin/cylinder cell performance CV/CC till 5A/5V.
used to measure and characterize the electrochemical analysis of different applications such as sensors, supercapacitors and batteries.
It is a device for measuring wavelengths of light over a wide range of the electromagnetic spectrum.
It is widely used for spectroscopic analysis of sample materials.
The incident light from the light source can be transmitted, absorbed or reflected through the sample.
PECVD is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate.
Chemical reactions are involved in the process, which occur after creation of plasma of the reacting gases.
The use of microwave irradiation is an efficient tool for nanocrystal synthesis.
can be used to increase the temperature of the sample up to 300oC and the pressure up to 30 Par according to the required specifications and time of operation.
The Emax is an entirely new type of ball mill for high energy milling.
The unique combination of high friction and impact results in extremely fine particles within the shortest amount of time.
Diamond blade micrometer precise sharp cutting edges of different substrates
Screen system with different mesh screens 5, 30 and 50 Microns.
Can be used to filter fine materials based on the powder size
In this ball milling,the powder mixture is subjected to high energy collision from solid balls.
Exfoliation of powder samples as well as large particles grinding